International Journal of Image, Graphics and Signal Processing(IJIGSP)

ISSN: 2074-9074 (Print), ISSN: 2074-9082 (Online)

Published By: MECS Press

IJIGSP Vol.12, No.3, Jun. 2020

Automated Quality Inspection of PCB Assembly Using Image Processing

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Punith Kumar M B, Shreekanth T, Prajwal M R

Index Terms

Image processing;Solder paste;X-Ray;Conformal Coating;PCB;Automation


Quality inspection of PCB is a crucial stage in the assembly line as it provides an insight on whether the board works correctly or not. When the inspection is done manually, it is susceptible to human errors and is time consuming. The boards should thus be inspected at every stage of the assembly line and the process should be dynamic. This is achieved in this work through three crucial stages in the assembly line and by replacing the conventional manual inspection by using image processing to obtain a faster and more precise quality inspection. The solder paste inspection consists of pre-processing using blue plane conversion, comparing with the unsoldered board in blue color plane and post processing using overlay. The X-ray inspection basically consists of pre- processing the captured image by RGB to gray conversion with thresholding, comparing with the expected image and post processing using overlay to show the shorts that has occurred along the assembly. The conformal coating inspection uses conversion of the blue intensity emitted off the board under UV light to RGB scale. Each of the algorithms were tested using 48 actual in-production boards from Vinyas IT Pvt Ltd, a PCB assembly company based in Mysore. The processing time of the algorithms were found to be less than 2 seconds with an accuracy of 85.7%. The system was also found to be cost effective over existing systems available in the market.

Cite This Paper

Punith Kumar M B, Shreekanth T, Prajwal M R, " Automated Quality Inspection of PCB Assembly Using Image Processing", International Journal of Image, Graphics and Signal Processing(IJIGSP), Vol.12, No.3, pp. 13-19, 2020.DOI: 10.5815/ijigsp.2020.03.02


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